Lamination And Microstructuring Technology for a Bio-Cell Multiwell array

Microtechnology becomes a versatile tool for biological and biomedical applications. Microwells have been established long but remained non-intelligent up to now. Merging new fabrication techniques and handling concepts with microelectronics enables to realize intelligent microwells suitable for future improved cancer treatment. The described technology depicts the basis for the fabrication of a elecronically enhanced microwell. Thin aluminium sheets are structured by laser micro machining and laminated successively to obtain registration tolerances of the respective layers of 5..10\^A$\mu$m. The microwells lasermachined into the laminate are with 50..80\^A$\mu$m diameter, allowing to hold individual cells within the well. The individual process steps are described and results on the microstructuring are given.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages

Reliability issues as a consequence of thermal/mechanical stresses created during packaging processes have been the main obstacle towards the realisation of high volume 3D Integrated Circuit (IC) integration technology for future microelectronics. However, there is no compelling laboratory-based metrology that can non-destructively measure or image stress/strain or warpage inside packaged chips, System-on-Chip (SoC) or System-in-Package (SiP), which is identified as a requirement by the International Technology Roadmap for Semiconductors (ITRS). In the work presented here, a triple-axis Jordan Valley Bede D1 X-ray diffractometer is used to develop a novel lab-based technique called X-ray diffraction 3-dimensional surface modeling (XRD/3DSM) for non-destructive analysis of manufacturing process-induced stress/warpage inside completely encapsulated packaged chips. The technique is demonstrated at room temperature and at elevated temperatures up to 115C by in situ XRD annealing experiments. The feasibility of this technique is confirmed through the charactersation of die stress inside encapsulated commercially available ultra-thin Quad Flat Non-lead (QFN) packages, as well as die stress in embedded QFN packages at various stages of the chip manufacturing proces

Multi-functional metasurface architecture for amplitude, polarization and wavefront control

Metasurfaces (MSs) have been utilized to manipulate different properties of electromagnetic waves. By combining local control over the wave amplitude, phase, and polarization into a single tunable structure, a multi-functional and reconfigurable metasurface can be realized, capable of full control over incident radiation. Here, we experimentally validate a multi-functional metasurface architecture for the microwave regime, where in principle variable loads are connected behind the backplane to reconfigurably shape the complex surface impedance. As a proof-of-concept step, we fabricate several metasurface instances with static loads in different configurations (surface mount capacitors and resistors of different values in different connection topologies) to validate the approach and showcase the different achievable functionalities. Specifically, we show perfect absorption for oblique incidence (both polarizations), broadband linear polarization conversion, and beam splitting, demonstrating control over the amplitude, polarization state, and wavefront, respectively. Measurements are performed in the 4-18 GHz range inside an anechoic chamber and show good agreement with theoretically-anticipated results. Our results clearly demonstrate the practical potential of the proposed architecture for reconfigurable electromagnetic wave manipulation.Comment: 6 pages, 5 figure

XR-RF Imaging Enabled by Software-Defined Metasurfaces and Machine Learning: Foundational Vision, Technologies and Challenges

We present a new approach to Extended Reality (XR), denoted as iCOPYWAVES, which seeks to offer naturally low-latency operation and cost-effectiveness, overcoming the critical scalability issues faced by existing solutions. iCOPYWAVES is enabled by emerging PWEs, a recently proposed technology in wireless communications. Empowered by intelligent (meta)surfaces, PWEs transform the wave propagation phenomenon into a software-defined process. We leverage PWEs to i) create, and then ii) selectively copy the scattered RF wavefront of an object from one location in space to another, where a machine learning module, accelerated by FPGAs, translates it to visual input for an XR headset using PWEdriven, RF imaging principles (XR-RF). This makes for an XR system whose operation is bounded in the physical layer and, hence, has the prospects for minimal end-to-end latency. Over large distances, RF-to-fiber/fiber-to-RF is employed to provide intermediate connectivity. The paper provides a tutorial on the iCOPYWAVES system architecture and workflow. A proof-of-concept implementation via simulations is provided, demonstrating the reconstruction of challenging objects in iCOPYWAVES produced computer graphics

Photonic Label-Free Biosensors for Fast and Multiplex Detection of Swine Viral Diseases

[EN] In this paper we present the development of photonic integrated circuit (PIC) biosensors for the label-free detection of six emerging and endemic swine viruses, namely: African Swine Fever Virus (ASFV), Classical Swine Fever Virus (CSFV), Porcine Reproductive and Respiratory Syndrome Virus (PPRSV), Porcine Parvovirus (PPV), Porcine Circovirus 2 (PCV2), and Swine Influenza Virus A (SIV). The optical biosensors are based on evanescent wave technology and, in particular, on Resonant Rings (RRs) fabricated in silicon nitride. The novel biosensors were packaged in an integrated sensing cartridge that included a microfluidic channel for buffer/sample delivery and an optical fiber array for the optical operation of the PICs. Antibodies were used as molecular recognition elements (MREs) and were selected based on western blotting and ELISA experiments to ensure the high sensitivity and specificity of the novel sensors. MREs were immobilized on RR surfaces to capture viral antigens. Antibody-antigen interactions were transduced via the RRs to a measurable resonant shift. Cell culture supernatants for all of the targeted viruses were used to validate the biosensors. Resonant shift responses were dose-dependent. The results were obtained within the framework of the SWINOSTICS project, contributing to cover the need of the novel diagnostic tools to tackle swine viral diseases.This work was funded by the EU-2020 program under grant agreement Nº 771649-SWINOSTICS project.Gómez-Gómez, MI.; Sánchez, C.; Peransi, S.; Zurita, D.; Bellieres, L.; Recuero, S.; Rodrigo, M.... (2022). Photonic Label-Free Biosensors for Fast and Multiplex Detection of Swine Viral Diseases. Sensors. 22(3):1-14. https://doi.org/10.3390/s2203070811422

The Importance of Future Kindergarten Teachers' Beliefs about the Usefulness of Games Based Learning

This paper examines the importance of future kindergarten teachers' beliefs about the usefulness of Games Based Learning in Early Childhood Education. Data were collected by using questionnaires which were given to the participants at the end of an introductory level, Information and Communication Technologies course. The sample of this study was 200 students attending a Bachelor in Education degree at the faculty of Early Childhood Education, University of Athens, in Greece. Results indicated that the majority of the sample had very positive beliefs about the use of Games Based Learning in pre-school education. Most of the students agreed that educational digital games are a useful way to enhance young children's learning. Beliefs were significantly affected by: year of study, frequency of computer usage, experience in a pre-school classroom, previous experience in playing computer games, and previous courses about the use/integration of educational technologies in kindergarten classroom. © 2014, IGI Global. All rights reserved

The development of balling technologies for wafer level devices with pitches down to 400µm pitch

Solder bumping usually represents the final stage in the WLP assembly process prior to dicing. Standard solder paste print & reflow techniques can be utilised but the resultant bumps invariably fall below specifications due to process limitations. More commonly, dedicated equipment sets that place pre-formed solder spheres onto the wafer are used. This paper details work undertaken to combine the benefits of standard stencil printer technology with that of solid solder sphere placement to enable the development of a low cost, flexible system for the bumping of wafer level packages

Embedded power modules - a new approach using Power Core and High Power PCB

The spectrum of conventional power electronics packaging reaches from SMD packages for power chips to large power modules. In most of these packages the power semiconductors are connected by bond wires, resulting in large resistances and parasitic inductances. Power chip packages have to carry semiconductors with increasing current densities. Conventional wire bonds are limiting their performance. Today's power modules are based on DCB (Direct Copper bonded) ceramic substrates. IGBT switches are mounted onto the ceramic and their top side contacts are connected by thick Al wires. This allows one wiring layer only and makes an integration of driver chips very difficult. Additionally, bond wires result in a high stray inductance which limits the switching frequency. Especially for the use of ultra-fast switching semiconductors, like SiC and GaN, it is very difficult to realize low inductive packages. A new approach for embedded power modules will be presented, which can cover different application fields, ranging from 50 W over 500 W to 50kW power modules for different applications like single chip packages, over power control units for pedelec (Pedal Electric Cycle), to inverter modules for automotive applications. This approach will focus on a power core base structure for with embedded semiconductors, which is then connected to a high power PCB. The connection to the embedded die is realized by a direct copper connection only. The technology principle will be described in detail. The embedding of chips offers a solution for many of the problems in power chip packages and power modules. While chip embedding was an academic exercise a decade ago, it is now an industrial solution [1]. A huge advantage of packaging using PCB technology is the cost-effective processing on large panel. Furthermore embedded packages and modules allow either double-side cooling or 3D assembly of components like capacitors, gate drivers or controllers

Stencil printing technology for 100m flip chip bumping

Stencil printing remains the technology route of choice for flip chip bumping because of its economical advantages over traditionally costly evaporation and electroplating processes. This paper deals with all processing facets of 6 wafer bumping of peripheral array structures at 100m pitch. Both type 7 (2-11m) and type 6 (5-15m) pastes of eutectic composition Sn63/Pb37 in conjunction with electroformed stencil technology have been successfully employed for wafer bumping. Bumping using 30m stencil thickness has yielded bump heights of 42.3±3.8m and 43.6±3.5m for type 7 and type 6 pastes, respectively. Alternative stencil design scenarios are exploited and it turns out that staggered designs provide effective solutions for aperture decoupling and optimization of overprinted paste volumes for peripheral ultra fine pitch configurations. Furthermore. the present study provides insights into the fundamental understanding of the printing performance of very fine pastes and con tributes in defining the narrow process windows of type 6 and type 7 pastes for wafer bumping, it is shown that type 6 paste is more appropriate than type 7 for the stencil aperture dimensions used in the present study